3D BGA Reballing Stencil A10
- Model: 3D BGA Reballing Stencil A10
- 1.High accurate hole by laser making for easy solder pasting.
- 2.With magnet for the better accurate positioning.
- 3.Imported steel with high temperature resistance, not easy to bend out.
- 4.When pasting the tin, laser making hole can grant the reballing effect.
- 5.Double “X” groove shape design for Ventilation and not damage the IC