3D IC or BGA Reballing Stencil A8 A9 A10

  • $7.48

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  • Model: A8 A9 A10
  • Product name: 3D BGA reballing stencil
  • Material: High-quality steel, anti-corrosion, high temperature,
  • Model: for iPhone 6 / 6S /6 Plus / 7 / 7 Plus IC and CPU Repair
  • Application: accurate alignment,super high quality,stepped groove,easy to use
  • Color: Silver
  • Net Weight: 9 ~ 11g / pieces
  • Product Size: 85 X 69 X 1 MM
  • Gross Weight: 17g / piece
  • With Packaging Size: 115 X 85 X 2 MM